Samsung Electronics is set to deliver 1TB of DDR5 memory in a single module thanks to a breakthrough in DRAM manufacturing.

The South Korean company developed the memory industry’s first and highest-capacity 32-gigabit (Gb) DDR5 DRAM, which uses 12nm process technology.

In doing so, Samsung will be able to produce 1TB DDR5 memory modules, but there’s another benefit of the move to 32Gb DRAM. Compared to the existing 12nm-class 16Gb DDR5 DRAM, there’s a 10% reduction in power consumption when comparing 128GB modules.

According to SangJoon Hwang, EVP of DRAM Product & Technology at Samsung Electronics, initially the main customers for this DRAM will be data centers, AI, and big data:

“With our 12nm-class 32Gb DRAM, we have secured a solution that will enable DRAM modules of up to 1-terabyte (TB), allowing us to be ideally positioned to serve the growing need for high-capacity DRAM in the era of AI (Artificial Intelligence) and big data … We will continue to develop DRAM solutions through differentiated process and design technologies to break the boundaries of memory technology.”

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Samsung expects to start mass-producing 12nm-class 32Gb DDR5 DRAM before the end of 2023.

More memory in less space with lower power consumption is always going to prove popular for data center operators. However, this memory technology should eventually filter down to the DDR5 modules found in our desktop PCs and laptops. Right now, 192GB memory kits consisting of four modules seem to be the high-end for consumers.

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