The Tensor G3 chip, which is reportedly made by Samsung and is based on its Exynos 2400, could be the first Samsung Foundry chip to incorporate FO-WLP (Fan-out wafer-level packaging) packaging. This enhanced wafer-level packaging will, in theory, allow for better efficiency, improved graphics performance, and more energy being saved.

FO-WLP has been used by Qualcomm and MediaTek, but this is supposedly the first time Samsung Foundry is using the tech.

The Pixel 8's Tensor G3 will run cooler than the G2

The 4nm Tensor G3 will be inside the Pixel 8 and Pixel 8 Pro and will have a 9-core CPU – one Cortex-X3 prime core, four Cortex-A715s, and four Cortex-A510s. For graphics, it will use the 10-core Arm Immortalis G715 GPU – up from the 7-core G710.

The Pixel 8 series will arrive on October 4.

The Tensor G3 is the first among Samsung Foundry’s smartphone chips to incorporate FO-WLP packaging, which is expected to reduce heat generation and increase power efficiency for the Tensor G3.

— Revegnus (@Tech_Reve) September 11, 2023

[ For more curated Samsung news, check out the main news page here]

The post The Pixel 8’s Tensor G3 will run cooler than the G2 first appeared on

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