From www.gsmarena.com

Nothing Phone (2a) will be powered by a custom Dimensity 7200 Pro chipset co-developed with MediaTek. Nothing claims its new chipset brings an 18% boost in performance over Phone (1) and its Snapdragon 778G+ while drawing 16% less power. The chip is fabbed on TSMC’s second-generation 4nm process which was a key decision for Nothing over Qualcomm Snapdragon chipsets like the 782G and 7s Gen2 which were also considered for the Phone (2a).

Nothing Phone (2a) confirmed to pack custom Dimensity 7200 Pro chipset

Dimensity 7200 Pro features an eight-core CPU with 2x Arm Cortex-A715 clocked at 2.8 GHz, and 6x Arm Cortex-A510. We already saw a leaked AnTuTu listing for the device with a total score of 738,164 points. Nothing is also advertising its new Smart Clean optimization for boosting read and write speeds.

Nothing is also touting improved integration between the chip and the Nothing OS software and lower power draw for components like the display and modem. Nothing also improved transfer speeds between Phone (2a) and Windows PCs thanks to optimizations made on the Dimensity 7200 Pro chip.

Nothing Phone (2a) will be announced on March 5.

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The post Nothing Phone (2a) confirmed to pack custom Dimensity 7200 Pro chipset first appeared on www.gsmarena.com

New reasons to get excited everyday.



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